UV dicing tape
「UV dicing tape」熱門搜尋資訊
「UV dicing tape」文章包含有：「DicingTape」、「TapeforDicing」、「UVCurableDicingTape」、「UVCurableDicingTape」、「UVDicingTape」、「UVDICINGTAPE」、「UVReleaseDicingTape」、「晶圓切割膠帶(UVDicingTape)」
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Dicing Tape
https://www.linteceurope.com
The tape's strong adhesion secures wafers during dicing, and then is reduced by UV irradiation to facilitate pick-up. This dicing tape is essential for full-cut ...
Tape for Dicing
https://www.furukawa.co.jp
This tape is used to hold semiconductor wafer during dicing/singulation process. Feature. Strong Adhesion before UV Irradiation. Easy Peel-off after UV ...
UV Curable Dicing Tape
https://www.semicorp.com
Very high adhesive strength secures wafers firmly during dicing, while allowing for easy removal after exposure. SPECIFICATIONS. P/N 24216 UE-2091J Extra High ...
UV Curable Dicing Tape
https://www.adwill-global.com
The tape's strong adhesion secures wafers during dicing, and then is reduced by UV irradiation to facilitate pick-up. This dicing tape is essential for ...
UV Dicing Tape
https://www.koatech.com.tw
Detailed information of UV Dicing Tape offered by Koatech Technology Corporation. ... UV Dicing Tape. No Adhesive Residue afer UV Debond
UV DICING TAPE
https://www.toyo-adtec.com.tw
Suitable for silicon wafer、LED、BGA、QFN、ceramic、glass cutting. Dicing Tape (UV Type). Item, Backing, Color, Base
UV Release Dicing Tape
https://en.solarplus-tape.com
UV release tapes are used in wafer back grinding or wafer dicing. After UV light curing on the tape, the adhesion drops and let the tape release from the ...
晶圓切割膠帶(UV Dicing Tape)
https://www.everisland.com
延展效果佳，適用於擴膜產品。 防止Chip殘膠。 減少Chip切割背崩不良。 解UV效果優良，提高Pickup效率。